<?xml version='1.0'?><rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:georss="http://www.georss.org/georss" xmlns:atom="http://www.w3.org/2005/Atom" >
<channel>
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	<atom:link href="https://publme.space/reactions/v/53796" rel="self" type="application/rss+xml" />
	<description><![CDATA[]]></description>
	
	<item>
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	<pubDate>Thu, 15 May 2025 22:00:41 +0200</pubDate>
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	<title><![CDATA[Posted Reaction by PublMe bot in PublMe]]></title>
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<p>LACED: Peeling Back PCB Layers With Chemical Etching and a Laser</p>
<div><img width="800" height="405" src="https://hackaday.com/wp-content/uploads/2025/05/multilayer_pcb_cnc_machine_mikeselectricstuff.jpg?w=800" alt="Exposed inner copper on multilayer PCB. (Credit: mikeselectricstuff, YouTube)" srcset="https://hackaday.com/wp-content/uploads/2025/05/multilayer_pcb_cnc_machine_mikeselectricstuff.jpg 1386w, https://hackaday.com/wp-content/uploads/2025/05/multilayer_pcb_cnc_machine_mikeselectricstuff.jpg?resize=250, 126 250w, https://hackaday.com/wp-content/uploads/2025/05/multilayer_pcb_cnc_machine_mikeselectricstuff.jpg?resize=400, 202 400w, https://hackaday.com/wp-content/uploads/2025/05/multilayer_pcb_cnc_machine_mikeselectricstuff.jpg?resize=800, 405 800w" data-attachment-id="780003" data-permalink="https://hackaday.com/2025/05/15/laced-peeling-back-pcb-layers-with-chemical-etching-and-a-laser/multilayer_pcb_cnc_machine_mikeselectricstuff/" data-orig-file="https://hackaday.com/wp-content/uploads/2025/05/multilayer_pcb_cnc_machine_mikeselectricstuff.jpg" data-orig-size="1386,701" data-comments-opened="1" data-image-meta="{&quot;aperture&quot;:&quot;0&quot;,&quot;credit&quot;:&quot;&quot;,&quot;camera&quot;:&quot;&quot;,&quot;caption&quot;:&quot;&quot;,&quot;created_timestamp&quot;:&quot;0&quot;,&quot;copyright&quot;:&quot;&quot;,&quot;focal_length&quot;:&quot;0&quot;,&quot;iso&quot;:&quot;0&quot;,&quot;shutter_speed&quot;:&quot;0&quot;,&quot;title&quot;:&quot;&quot;,&quot;orientation&quot;:&quot;0&quot;}" data-image-title="multilayer_pcb_cnc_machine_mikeselectricstuff" data-image-description="&lt;p&gt;https://www.youtube.com/watch?v=RHqN6CTOdzA&lt;/p&gt;" data-image-caption="&lt;p&gt;Exposed inner copper on multilayer PCB. (Credit: mikeselectricstuff, YouTube)&lt;/p&gt;" data-medium-file="https://hackaday.com/wp-content/uploads/2025/05/multilayer_pcb_cnc_machine_mikeselectricstuff.jpg?w=400" data-large-file="https://hackaday.com/wp-content/uploads/2025/05/multilayer_pcb_cnc_machine_mikeselectricstuff.jpg?w=800"></div><p>Once a printed circuit board (PCB) has been assembled it’s rather hard to look inside of it, which can be problematic when you have e.g. a multilayer PCB of an (old) system that you really would like to dissect to take a look at the copper layers and other details that may be hidden inside, such as Easter eggs on inner layers. [Lorentio Brodeso]’s <a rel="nofollow" href="https://github.com/LawrenceBrode/LACED" target="_blank">‘LACED’ project</a> offers one such method, using both chemical etching and a 5 Watt diode engraving laser to remove the soldermask, copper and FR4 fiberglass layers.</p><p>This project uses sodium hydroxide (NaOH) to dissolve the solder mask, followed by hydrogen chloride (HCl) and hydrogen peroxide (H<sub>2</sub>O<sub>2</sub>) to dissolve the copper in each layer. The engraving laser is used for the removing of the FR4 material. Despite the ‘LACED’ acronym standing for <em>Laser-Controlled Etching and Delayering</em>, the chemical method(s) and laser steps are performed independently from each other.</p><p>This makes it in a way a variation on the more traditional CNC-based method, as <a rel="nofollow" href="https://www.youtube.com/watch?v=RHqN6CTOdzA" target="_blank">demonstrated by [mikeselectricstuff]</a> (as shown in the top image) back in 2016, alongside the <a rel="nofollow" href="https://www.youtube.com/watch?v=iV4LJX1HdPk" target="_blank">detailed setup video</a> of how a multi-layer PCB was peeled back with enough resolution to make out each successive copper and fiberglass layer.</p><p></p><p>The term ‘laser-assisted etching’ is generally used for e.g. <a rel="nofollow" href="https://www.mdpi.com/2076-3417/12/3/948" target="_blank">glass etching with HF or KOH</a> in combination with a femtosecond laser to realize high-resolution optical features, <a rel="nofollow" href="https://pmc.ncbi.nlm.nih.gov/articles/PMC9030282/" target="_blank">‘selective laser etching’</a> where the etchant is assisted by the laser-affected material, or the related <a rel="nofollow" href="https://www.researchgate.net/publication/354108533_Review_on_laser-induced_etching_processing_technology_for_transparent_hard_and_brittle_materials" target="_blank">laser-induced etching</a> of hard &amp; brittle materials. Beyond these there is a <a rel="nofollow" href="https://www.a-optowave.com/news/laser-assisted-chemical-processing-of-materials/" target="_blank">whole world</a> of laser-induced or laser-activated etching or functionalized methods, all of which require that the chemical- and laser-based steps are used in unison.</p><p>Aside from this, the use of chemicals to etch away soldermask and copper does of course leave one with a similar messy clean-up as when etching new PCBs, but it can provide more control due to the selective etching, as a CNC’s carbide bit will just as happily chew through FR4 as copper. When reverse-engineering a PCB you will have to pick whatever method works best for you.</p><p>Top image: Exposed inner copper on multilayer PCB. (Credit: <a rel="nofollow" href="https://www.youtube.com/watch?v=RHqN6CTOdzA" target="_blank">mikeselectricstuff</a>, YouTube)</p>]]></description>
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</item>

</channel>
</rss>